The Leakers don’t want to wait for Qualcomm’s Tech summit which is going to be held in December and has already leaked SD735 and its the turn of big brother i.e. Snapdragon 865. The leakster through weibo has leaked engineering parameters of the next flagship SOC by Qualcomm.
We already knew that next soc will have both 4G and 5G support, but as per leakster the CPU will have tri cluster combination with the most powerful cluster to have one Cortex A77 at 2.84GHz, the second cluster will have 3 Cortex A77 clocked at 2.42Ghz. The last power saving cluster will have Cortex A55 running at 1.8GHz. The GPU duty is handled by Adreno 650 running at 587MHz.
These chips will be manufactured at 7nm+ process node most probably from Samsung. LPDDR 5 is supposed to be supported by the chip.
Coming to performance, the tipster has also revealed that CPU will perform better by 20% and GPU is also expected to perform 17% to 20% higher than the previous Snapdragon 855 SOC. But considering that Qualcomm also launched Snapdragon 855+ which already boosted CPU performance by 5% and GPU by 15%, the new Snapdragon 865 seems like a modest upgrade performance wise.
The next performance boost should come with Snapdragon 875 which will be benefitted for 5nm manufacturing process.
These are just leaks and the performance uplift could be based on engineering sample and could change in final silicon. Let’s wait till December where Qualcomm will open up its cards.
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